Repair Supervisor

Position SummaryThe Repair Supervisor leads daily commodity-level repair operations (motherboards, DIMMs, HDDs/SSDs) in the server repair cage, ensuring safety, workmanship quality, full traceability, and repair turnaround time (TAT) against return-to-test targets. The role owns board-level rework quality, failure analysis feedback to Test and suppliers, and secure handling of customer media in a 24/7 multi-shift environment.Key ResponsibilitiesLead daily commodity repair operations (motherboards, DIMMs, HDDs/SSDs) in the repair cage.Manage repair WIP, aging control, and turnaround time (TAT) against return-to-test targets; prioritize by material criticality and rack-down status.Own workmanship quality: IPC standards compliance, AOI results interpretation, rework verification, and escape prevention.Drive failure analysis: Pareto by defect code, NTF (No Trouble Found) rate management, and root cause feedback to Test and suppliers.Maintain full traceability: defect coding, repair history logging, part-level serial tracking, quarantine/MRB handling, and scrap control/certification.Enforce media sanitization, secure handling, and chain of custody for customer drives per hyperscale security requirements.Own the ESD control program and safety compliance: ESD audits, chemical/solder fume handling, and 5S in repair areas.Manage manpower, shift schedules, and overtime; coach repair technicians.Coordinate with the Testing Supervisor on rack-down priorities and express rework line flow.Prepare TAT and repair yield reporting; drive Kaizen and standard work compliance.Qualifications & ExperienceBachelor's degree required (Electronics, Mechanical, Systems or related field).3–5 years in electronics repair/rework operations, with at least 1–2 years supervising repair technicians.Board-level (L5/L6) repair experience — required. Component-level diagnosis and rework on server motherboards: BGA/SMT rework, soldering standards (IPC-A-610 / IPC-7711/7721), and ESD control program ownership.Experience with commodity-level failure analysis and disposition: DIMMs, HDDs/SSDs, motherboards — repair vs. scrap vs. RTV decisions.Experience managing repair WIP and turnaround time (TAT) against dock-to-stock or return-to-test targets.Traceability and quality systems experience: defect coding, repair history logging, part-level serial tracking, and failure Pareto feedback to Test for yield improvement.Familiarity with media sanitization, secure handling, and chain of custody for customer drives (hyperscale/data center security requirements).Exposure to hyperscale/data center customers and their repair/scrap authorization requirements — preferred.Skills & CompetenciesRepair floor management — repair station layout and flow (U-shaped/express line), WIP aging control, prioritization by material criticality.Quality & workmanship standards — IPC standards, AOI results interpretation, rework verification, escape prevention.Failure analysis — Pareto by defect code, NTF rate management, root cause feedback loop to Test and suppliers.Materials & traceability — component-level tracking, quarantine/MRB handling, scrap control and certification.ESD and safety compliance — ESD program audits, chemical/solder fume handling, 5S in repair areas.Communication — TAT and yield reporting, coordination with the Testing Supervisor on rack-down priorities. Bilingual English/Spanish.Systems & tools — repair tracking systems/MES, Excel and PowerPoint reporting, Kaizen.Region/Country-Specific RequirementsMust be legally authorized to work in the United States.