Senior Process Engineer

Senior Process Engineer | $160,000–$190,000 + Equity | Hybrid | San Diego, CAA rapidly growing photonics technology company is developing next-generation optical products for AI, data centre and high-performance computing applications.We’re looking for a Senior Process Engineer with strong hands-on experience in advanced packaging and manufacturing processes, particularly Flip Chip and Thermo-Compression Bonding (TCB).What you’ll be doing:Develop and optimise optoelectronic assembly processesLead Flip Chip and TCB process developmentSupport 2.5D/3D packaging integrationWork with suppliers and manufacturing partners to scale processesDesign and execute DOE to improve yield and performanceMonitor process health, including yield and failure Pareto trendsDevelop SOWs and project plans for new process developmentWhat we’re looking for:5+ years' experience in manufacturing/process engineeringStrong expertise in Flip Chip and Thermo-Compression BondingExperience with 2.5D/3D packaging and reliability challengesExperience with DOE, Gage R&R and statistical analysis using JMP, Minitab or similarExperience with FMEAUnderstanding of optoelectronic devices and packaging reliabilityKnowledge of microelectronics/photonics packaging processesBachelor's degree in Engineering, Physics or a related disciplineComfortable working in a fast-paced, high-growth environmentThis is an opportunity to join an ambitious and growing technology business working on advanced products at the intersection of photonics, semiconductors and high-performance computing.

Location: San Diego, CA – HybridSalary: $160,000–$190,000 + Equity + Full Benefits Package